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NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing

Rs. 299.00 Rs. 699.00
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NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing

Description

  • Excellent capacity of solder-stickiness
  • * Excellent Anti-wet Capacity 
  • * Widely used on BGA, PGA, CSP packages, and flip chip operation 
  • * Suitable for multiple PCB reflow
  • * No-clean and Lead-free for environmental protection
  • * 100% brand new high quality
  • * Made of high-quality materials for durability
  • * NC-559-ASM BGA Flux Solder Paste Flux 100g Flux.
  • * No-clean solder paste.
  • * Less residue, welding light, less smoke, no irritating odor.
  • * High viscosity no-clean fluxes can be used for rework, ball, or lead attachment to BGA, CGA, and CSP packages and assembly operations.
  • * For example, the flip chip is fixed on the PWB substrate, and the good formula of BGA ball/ball can make the ball fit better

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Unbranded

NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing

Rs. 299.00 Rs. 699.00
View product