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NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing

Name: NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing
Brand: Unbranded
Price: 299.00 INR
Availability: OutOfStock

Rs. 299.00 Rs. 699.00

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Soldering Solution

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Description

Excellent capacity of solder-stickiness
* Excellent Anti-wet Capacity
* Widely used on BGA, PGA, CSP packages, and flip chip operation
* Suitable for multiple PCB reflow
* No-clean and Lead-free for environmental protection
* 100% brand new high quality
* Made of high-quality materials for durability
* NC-559-ASM BGA Flux Solder Paste Flux 100g Flux.
* No-clean solder paste.
* Less residue, welding light, less smoke, no irritating odor.
* High viscosity no-clean fluxes can be used for rework, ball, or lead attachment to BGA, CGA, and CSP packages and assembly operations.
* For example, the flip chip is fixed on the PWB substrate, and the good formula of BGA ball/ball can make the ball fit better

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