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Unbranded | SKU:
NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing
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Um 57% reduziert
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Rs. 299.00
Normaler Preis
Rs. 699.00
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NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing ist auf Lager und wird versandt, sobald es wieder verfügbar ist
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Beschreibung
Beschreibung
- Excellent capacity of solder-stickiness
- * Excellent Anti-wet Capacity
- * Widely used on BGA, PGA, CSP packages, and flip chip operation
- * Suitable for multiple PCB reflow
- * No-clean and Lead-free for environmental protection
- * 100% brand new high quality
- * Made of high-quality materials for durability
- * NC-559-ASM BGA Flux Solder Paste Flux 100g Flux.
- * No-clean solder paste.
- * Less residue, welding light, less smoke, no irritating odor.
- * High viscosity no-clean fluxes can be used for rework, ball, or lead attachment to BGA, CGA, and CSP packages and assembly operations.
- * For example, the flip chip is fixed on the PWB substrate, and the good formula of BGA ball/ball can make the ball fit better
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